Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Results 1-3 of 68
Page 10
The adhesion of various low k dielectric films on different substrate surfaces were
studied by using a simple adhesive tape test . The results are summarized in
Table VII . As indicated in Table VII , the adhesion was poor for many of the low k
...
The adhesion of various low k dielectric films on different substrate surfaces were
studied by using a simple adhesive tape test . The results are summarized in
Table VII . As indicated in Table VII , the adhesion was poor for many of the low k
...
Page 84
RESULTS AND DISCUSSION A variety of polyimides ( thermally stable matrix )
and labile blocks have been studied . The specific polyimides were chosen
because of their high To ' s and other properties each possessed . The structures
of ...
RESULTS AND DISCUSSION A variety of polyimides ( thermally stable matrix )
and labile blocks have been studied . The specific polyimides were chosen
because of their high To ' s and other properties each possessed . The structures
of ...
Page 111
Of the many low dielectric constant polymers currently being studied , polyimides
are the most mature with respect to processing ... Previous studies using SIMS (
Secondary Ion Mass Spectroscopy ) indicated copper to move rapidly throughout
...
Of the many low dielectric constant polymers currently being studied , polyimides
are the most mature with respect to processing ... Previous studies using SIMS (
Secondary Ion Mass Spectroscopy ) indicated copper to move rapidly throughout
...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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Common terms and phrases
absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers