Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 19
FLUORINATED , LOW THERMAL EXPANSION COEFFICIENT POLYIMIDES
FOR INTERLAYER DIELECTRIC APPLICATIONS : THERMAL STABILITY ,
REFRACTIVE INDEX AND HIGH TEMPERATURE MODULUS
MEASUREMENTS BRIAN ...
FLUORINATED , LOW THERMAL EXPANSION COEFFICIENT POLYIMIDES
FOR INTERLAYER DIELECTRIC APPLICATIONS : THERMAL STABILITY ,
REFRACTIVE INDEX AND HIGH TEMPERATURE MODULUS
MEASUREMENTS BRIAN ...
Page 66
Thermal Stability High thermal stability in organic polymer dielectrics is a crucial
and primary requirement . We have evaluated the thermal stability of a FLARETM
derivative in both free - standing thin film form and as a coating on silicon ...
Thermal Stability High thermal stability in organic polymer dielectrics is a crucial
and primary requirement . We have evaluated the thermal stability of a FLARETM
derivative in both free - standing thin film form and as a coating on silicon ...
Page 124
THERMAL STABILITY STUDY OF PARYLENE N Parylene N is a vapor deposited
polymer with excellent conformality ' . The chemical composition of the Parylene
N monomer is CH2C6H . CH2 . Thermal analysis of Parylene was made on ...
THERMAL STABILITY STUDY OF PARYLENE N Parylene N is a vapor deposited
polymer with excellent conformality ' . The chemical composition of the Parylene
N monomer is CH2C6H . CH2 . Thermal analysis of Parylene was made on ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers