Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 19
... THERMAL EXPANSION COEFFICIENT POLYIMIDES FOR INTERLAYER DIELECTRIC APPLICATIONS : THERMAL STABILITY , REFRACTIVE INDEX AND HIGH TEMPERATURE MODULUS MEASUREMENTS BRIAN C. AUMAN DuPont Electronic Materials , Experimental Station , E334 ...
... THERMAL EXPANSION COEFFICIENT POLYIMIDES FOR INTERLAYER DIELECTRIC APPLICATIONS : THERMAL STABILITY , REFRACTIVE INDEX AND HIGH TEMPERATURE MODULUS MEASUREMENTS BRIAN C. AUMAN DuPont Electronic Materials , Experimental Station , E334 ...
Page 66
... Thermal Stability High thermal stability in organic polymer dielectrics is a crucial and primary requirement . We have evaluated the thermal stability of a FLARE TM derivative in both free - standing thin film form and as a coating on ...
... Thermal Stability High thermal stability in organic polymer dielectrics is a crucial and primary requirement . We have evaluated the thermal stability of a FLARE TM derivative in both free - standing thin film form and as a coating on ...
Page 124
... Thermal analysis of Parylene was made on TGA , FTIR and a Mass Spectrometer ( MS ) . TGA is a commonly used tool to characterize thermal stability . Figure 1 is a dynamic TGA analysis ramped at 10 ° C / min rate for Parylene N ( c.a. 1 ...
... Thermal analysis of Parylene was made on TGA , FTIR and a Mass Spectrometer ( MS ) . TGA is a commonly used tool to characterize thermal stability . Figure 1 is a dynamic TGA analysis ramped at 10 ° C / min rate for Parylene N ( c.a. 1 ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch