Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page vi
... Thermosetting Resins for Microelectronics .. 111 Leonard J. Buckley , Arthur Snow , James Griffith , Henry S.-W. Hu , and Mark Ray Low Thermal Budget Processing of Organic Dielectrics R. Sharangpani , R. Singh , K.C. Cherukuri , and ...
... Thermosetting Resins for Microelectronics .. 111 Leonard J. Buckley , Arthur Snow , James Griffith , Henry S.-W. Hu , and Mark Ray Low Thermal Budget Processing of Organic Dielectrics R. Sharangpani , R. Singh , K.C. Cherukuri , and ...
Page 110
... THERMOSETTING RESINS FOR MICROELECTRONICS Leonard J. Buckley. Figure 5. Cross - sectional polyvinylphenol before SEM images of a photosensitive and after the fluorination . Figure 3. FTIR of evolved gases from dynamic TGA of. 110.
... THERMOSETTING RESINS FOR MICROELECTRONICS Leonard J. Buckley. Figure 5. Cross - sectional polyvinylphenol before SEM images of a photosensitive and after the fluorination . Figure 3. FTIR of evolved gases from dynamic TGA of. 110.
Page 111
... thermoset 111 Mat . Res . Soc . Symp . Proc . Vol . 381 © 1995 Materials Research Society ( triallyl ether ) is shown below in figure 1. Low Dielectric Constant Thermosetting Resins for Microelectronics Leonard J Buckley, Arthur Snow ...
... thermoset 111 Mat . Res . Soc . Symp . Proc . Vol . 381 © 1995 Materials Research Society ( triallyl ether ) is shown below in figure 1. Low Dielectric Constant Thermosetting Resins for Microelectronics Leonard J Buckley, Arthur Snow ...
Contents
Methods | 3 |
Fluorinated Low Thermal Expansion Coefficient Polyimides | 19 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured decrease density device dielectric film dielectric properties electrode electromigration FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film solvent spin-coated spin-on stress substrate surface Table technique Technology TEOS/O test structure thermal stability thin films ULSI vapor deposition wet etch