Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 46
... thin film with all the demanded properties , we have initiated research in two directions , molecular architecture and process methodology . Chemical vapor deposition has been one of the preferred processes for generating thin films of ...
... thin film with all the demanded properties , we have initiated research in two directions , molecular architecture and process methodology . Chemical vapor deposition has been one of the preferred processes for generating thin films of ...
Page 147
... ULTRATHIN POLYMER FILMS ON SILICON WEN - LI WU , WILLIAM E. WALLACE AND JOHN VAN ZANTEN Polymers Division , NIST , Gaithersburg , MD 20899 ABSTRACT The glass transition temperature , T. , of polystyrene ( PS ) thin films on silicon ...
... ULTRATHIN POLYMER FILMS ON SILICON WEN - LI WU , WILLIAM E. WALLACE AND JOHN VAN ZANTEN Polymers Division , NIST , Gaithersburg , MD 20899 ABSTRACT The glass transition temperature , T. , of polystyrene ( PS ) thin films on silicon ...
Page 165
... thin films has been used for the first time to evaluate coating quality on spin coated silicon wafers . In general , DVS - bisBCB thin films are easily produced defect free with a high degree of planarization . Various features of the ...
... thin films has been used for the first time to evaluate coating quality on spin coated silicon wafers . In general , DVS - bisBCB thin films are easily produced defect free with a high degree of planarization . Various features of the ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch