Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 46
... vapor depositable precursors and novel thin film vapor deposition processes as well , have been developed in our lab to synthesize and deposit polymers , such as Teflon AF 1600 ( amorphous fluoropolymer ) , Parylene - F ( fluorinated ) ...
... vapor depositable precursors and novel thin film vapor deposition processes as well , have been developed in our lab to synthesize and deposit polymers , such as Teflon AF 1600 ( amorphous fluoropolymer ) , Parylene - F ( fluorinated ) ...
Page 48
... vapor deposition apparatus . Poly ( naphthalene ) ( IIIA ) and poly ( fluorinated naphthalene ) ( IIIB ) were synthesized by vaporizing IA or IB in vacuo and the vapor was transported into a hot chamber where the temperature is ...
... vapor deposition apparatus . Poly ( naphthalene ) ( IIIA ) and poly ( fluorinated naphthalene ) ( IIIB ) were synthesized by vaporizing IA or IB in vacuo and the vapor was transported into a hot chamber where the temperature is ...
Page 50
... vapor depositable materials , they may become very attractive for future electronic applications as interlayer dielectrics . Table I Film PA - N PA - F Teflon AF PNT - N PNT - F Film vapor vapor vapor vapor vapor Deposition Source dimer ...
... vapor depositable materials , they may become very attractive for future electronic applications as interlayer dielectrics . Table I Film PA - N PA - F Teflon AF PNT - N PNT - F Film vapor vapor vapor vapor vapor Deposition Source dimer ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch