Physical Architecture of VLSI SystemsRob Hannemann, Allan D. Kraus, Michael Pecht "This practical guide covers the full spectrum of issues and problems that confront the packaging engineer and provides all the tools and information needed to overcome them. In this book, academic researchers, graduate students, and practicing mechanical, electrical, and materials engineers will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing thorough coverage of the interdisciplinary and interfunctional issues that come with the territory, the authors cover all physical systems, processes, and materials from chip edge through intersystem interconnect, including thermal control, soldering processes, selection of package materials, and much more; emphasize the interaction of electrical, mechanical, materials, and reliability engineering in the design of modern electronic products, particularly computers and consumer electronics; and focus on the underlying principles and technologies that will remain the basis for electronic design and manufacture through the next decade." "The first book to offer systematic treatment of the engineering science and applications art involved in the creation of microelectronic devices, Physical Architecture of VLSI Systems is essential reading for anyone interested in creating successful and reliable electronic products, both now and for years to come."--BOOK JACKET.Title Summary field provided by Blackwell North America, Inc. All Rights Reserved |
Contents
Robert J Hannemann Digital Equipment Corporation 146 Main Street | 1 |
Dennis Herrell Microelectronics and Computer Technology Corporation | 19 |
Semiconductor Packaging | 23 |
Copyright | |
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Common terms and phrases
adhesion alloy aluminum applications approach assembly bond pad cable capacitance characteristics chip carrier coaxial coefficient components conductor connections connector contact finish contact interface contact resistance contact spring copper corrosion cost cross-talk delay density deposition devices dielectric constant electrical performance etch example fabrication film flip-chip frequency function geometry gold heat heatsink hybrid IEEE impedance increase inductance interconnect capacity JEDEC laminate layers leadcount leadframe leads manufacturing mating MCM-D MCM-L mechanical metal molded multichip modules multilayer noise normal force pattern photoresist pin grid array pitch plastic plating polyimide polymer PQFP printed circuit board printed wiring board quad flatpack reliability requirements resistors Schematic shown in Figure signal silicon single-chip packages solder structure substrate surface mount switching tape temperature thermal conductivity thick-film thickness thin-film through-hole tion transmission line typically vias voltage wire wirebond
References to this book
Electronic Composites: Modeling, Characterization, Processing, and MEMS ... Minoru Taya No preview available - 2005 |