Physical Architecture of VLSI SystemsRob Hannemann, Allan D. Kraus, Michael Pecht "This practical guide covers the full spectrum of issues and problems that confront the packaging engineer and provides all the tools and information needed to overcome them. In this book, academic researchers, graduate students, and practicing mechanical, electrical, and materials engineers will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing thorough coverage of the interdisciplinary and interfunctional issues that come with the territory, the authors cover all physical systems, processes, and materials from chip edge through intersystem interconnect, including thermal control, soldering processes, selection of package materials, and much more; emphasize the interaction of electrical, mechanical, materials, and reliability engineering in the design of modern electronic products, particularly computers and consumer electronics; and focus on the underlying principles and technologies that will remain the basis for electronic design and manufacture through the next decade." "The first book to offer systematic treatment of the engineering science and applications art involved in the creation of microelectronic devices, Physical Architecture of VLSI Systems is essential reading for anyone interested in creating successful and reliable electronic products, both now and for years to come."--BOOK JACKET.Title Summary field provided by Blackwell North America, Inc. All Rights Reserved |
Contents
Introduction | 1 |
Semiconductor Packaging | 23 |
Interconnect Substrate Technologies | 99 |
Copyright | |
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Common terms and phrases
adhesion alloy alumina aluminum applications approach assembly attach bond pad cable capacitance chip carrier coefficient components conductor connections connector copper corrosion cost cross-talk density deposition devices dielectric constant electrical performance Electronic Packaging epoxy etch fabrication factor fatigue film flip chip frequency glass gold heat heatsink Hybrid IEEE increase inductance interconnect capacity interface JEDEC laminate layers leadcount leadframe leads manufacturing material MCM-D MCM-L mechanical metal microelectronic molded multichip modules multilayer noise pattern photoresist pin grid array pitch plastic plating polyimide polymer PQFP printed circuit board printed wiring board properties quad flatpack reliability resin resistance resistors shown in Figure signal silicon single-chip packages solder strength stress structure substrate surface mount TABLE tape temperature thermal conductivity thermal expansion thick-film thickness thin-film through-hole tion transmission line typically vias voltage wirebond
References to this book
Electronic Composites: Modeling, Characterization, Processing, and MEMS ... Minoru Taya No preview available - 2005 |