Thin Film Processes, Volume 2John L. Vossen, Werner Kern Academic Press, 1978 - Thin films |
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Page 5
John L. Vossen, Werner Kern. TABLE I OTHER THIN FILM BOOKS AND REFERENCES TO PROCESses Not CovERED IN THIS BOOK Topic Thin film deposition and etching books published after 1977 Techniques for preparing substrates for film deposition ...
John L. Vossen, Werner Kern. TABLE I OTHER THIN FILM BOOKS AND REFERENCES TO PROCESses Not CovERED IN THIS BOOK Topic Thin film deposition and etching books published after 1977 Techniques for preparing substrates for film deposition ...
Page 6
... Thin Films . " Academic Press , New York , 1982 . 10. R. F. Bunshah , ed . , " Deposition Technologies for Films and Coatings . " Noyes Publications , Park Ridge , New Jersey , 1982 . 11. R. V. Stuart , " Vacuum Technology , Thin Films ...
... Thin Films . " Academic Press , New York , 1982 . 10. R. F. Bunshah , ed . , " Deposition Technologies for Films and Coatings . " Noyes Publications , Park Ridge , New Jersey , 1982 . 11. R. V. Stuart , " Vacuum Technology , Thin Films ...
Page 204
... thin films will involve an integration of many different types of processes into more and more complex deposition systems . Sputtering will continue to play a very important role . REFERENCES 1. L. I. Maissel , in " Physics of Thin ...
... thin films will involve an integration of many different types of processes into more and more complex deposition systems . Sputtering will continue to play a very important role . REFERENCES 1. L. I. Maissel , in " Physics of Thin ...
Contents
Processing Plasmas | 16 |
rf Diode Plasmas | 24 |
Afterglow Plasmas | 37 |
Copyright | |
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alloy anode Appl applications AsH3 atoms chamber chemical chemical vapor deposition coatings composition compound Crystal Growth density deposition process deposition rate device dielectric dopant doping effects Electrochem emission epitaxial etch rate evaporation excitation film deposition flow flux GaAs gas-phase gases glow discharge grid growth rate heater heating increase ion beam ion bombardment ion energy ion source ionization kinetic laser layer Lett LPCVD magnetic field magnetron material metal molecules nitride OMVPE optical oxide particle PECVD photochemical photodeposition photon photoresist Phys plasma plasma etching potential precursor pressure Proc produce pump ratio reactants reaction reactor region remote PECVD semiconductor shown in Fig SiH4 silane silicon silicon nitride SiO2 sol-gel species sputter deposition sputtering stoichiometric substrate substrate temperature surface susceptor target techniques Technol Technology thermal thickness thin film Thin Solid Films tion torr typically vacuum voltage wafer wavelength