Thin film processes IIThis sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques. Key Features * Provides an all-new sequel to the 1978 classic, Thin Film Processes * Introduces new topics, and several key topics presented in the original volume are updated * Emphasizes practical applications of major thin film deposition and etching processes * Helps readers find the appropriate technology for a particular application |
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Page 65
The field strength in the center of the source is on the order of 250 G. The anode
in the multipole source is cylindrical and may even form the inner body of the
source. Electrons are emitted from a central heated filament and must traverse
field ...
The field strength in the center of the source is on the order of 250 G. The anode
in the multipole source is cylindrical and may even form the inner body of the
source. Electrons are emitted from a central heated filament and must traverse
field ...
Page 66
CATHODE field across the anode surface, again on the order of 50 G. Electrons
are emitted from a central cathode that is this time in a relatively magnetic- field-
free region. Electrons are deflected by magnetic field at the anode, and thejr net ...
CATHODE field across the anode surface, again on the order of 50 G. Electrons
are emitted from a central cathode that is this time in a relatively magnetic- field-
free region. Electrons are deflected by magnetic field at the anode, and thejr net ...
Page 250
The anode in the discharge circuit can be either an isolated electrode or the
vacuum chamber itself. In the latter case, it is normal practice to ground both the
positive side of the arc power supply and the vacuum chamber and its internal ...
The anode in the discharge circuit can be either an isolated electrode or the
vacuum chamber itself. In the latter case, it is normal practice to ground both the
positive side of the arc power supply and the vacuum chamber and its internal ...
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Common terms and phrases
alloy anode Appl applications AsH3 atoms cathode chamber chemical chemical vapor deposition coatings composition compound Crystal Growth density deposition rate device dielectric dopant doping effects Electrochem emission epitaxial etch rate evaporation excitation film deposition flow flux GaAs gas-phase gases glow discharge growth rate heater heating increase ion beam ion bombardment ion energy ion source ionization kinetic laser layer Lett LPCVD magnetic field magnetron material metal molecules nitride OMVPE optical oxide particle PECVD photochemical photodeposition photon photoresist Phys plasma plasma etching potential precursor pressure Proc produce pump ratio reactants reaction reactor refractory metal region remote PECVD RHEED semiconductor shown in Fig SiH4 silane silicon silicon nitride SiO2 sol-gel species sputter deposition sputtering structure substrate substrate temperature susceptor target techniques Technol Technology thermal thickness thin film Thin Solid Films tion torr typically vacuum voltage wafer wavelength
Bibliographic information
| Title | Thin film processes II Volume 2 of Thin Film Processes, Werner Kern |
| Authors | John L. Vossen, Werner Kern |
| Editors | John L. Vossen, Werner Kern |
| Edition | illustrated |
| Publisher | Academic Press, 1991 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 0127282513, 9780127282510 |
| Length | 866 pages |
| Subjects | › › Electronic books Science / Physics Technology & Engineering / Electronics / Semiconductors Technology & Engineering / Material Science Thin film devices Thin films |
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