Thin Film Processes, Volume 2John L. Vossen, Werner Kern Academic Press, 1978 - Thin films |
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Page 255
... applications , placing a major emphasis on the application of most current interest - deposition of nitrides and carbides of the refractory metals for wear and decorative applications . A. Metal and Elemental Film Deposition At the time ...
... applications , placing a major emphasis on the application of most current interest - deposition of nitrides and carbides of the refractory metals for wear and decorative applications . A. Metal and Elemental Film Deposition At the time ...
Page 265
... APPLICATIONS The development of applications for the CAPD process is at a very early stage ; relatively few applications have reached the stage of full commercial production . While the most well known and widespread of these applications ...
... APPLICATIONS The development of applications for the CAPD process is at a very early stage ; relatively few applications have reached the stage of full commercial production . While the most well known and widespread of these applications ...
Page 366
... Applications " ( B. Blewer , ed . ) . The Materials Research Society , Pittsburgh " Pennsylvania " , 1986 ; ( b ) “ Tungsten and Other Refractory Metals for VLSI Applications II ” ( E. Broadbent , ed . ) . The Materials Research Society ...
... Applications " ( B. Blewer , ed . ) . The Materials Research Society , Pittsburgh " Pennsylvania " , 1986 ; ( b ) “ Tungsten and Other Refractory Metals for VLSI Applications II ” ( E. Broadbent , ed . ) . The Materials Research Society ...
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alloy anode Appl applications AsH3 atoms cathode chamber chemical chemical vapor deposition coatings composition compound semiconductors compounds Crystal Growth CVD reactors density deposition process deposition rate device dielectric diffusion dopant doping effects Electrochem electron emission epitaxial etch rate film deposition flux GaAs gas-phase gases glow discharge grid growth rate heating increase ion beam ion bombardment ion energy ion source ionization K. F. Jensen kinetics laser layer Lett LPCVD magnetic field magnetron material metal mtorr nitride nucleation OMVPE optical oxide particle PECVD photochemical photodeposition photoresist Phys plasma plasma etching potential precursor pressure Proc produce pump ratio reactants reactive region remote PECVD semiconductor SiH4 silane silicides silicon silicon nitride SiO2 sol-gel species sputter deposition sputtering substrate substrate temperature susceptor target techniques Technol Technology thermal thin films Thin Solid Films tion torr typically vacuum voltage wafer wavelength