Thin Film Processes, Volume 2John L. Vossen, Werner Kern Academic Press, 1978 - Thin films |
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Page 255
... applications , placing a major emphasis on the application of most current interest - deposition of nitrides and carbides of the refractory metals for wear and decorative applications . A. Metal and Elemental Film Deposition At the time ...
... applications , placing a major emphasis on the application of most current interest - deposition of nitrides and carbides of the refractory metals for wear and decorative applications . A. Metal and Elemental Film Deposition At the time ...
Page 265
... APPLICATIONS The development of applications for the CAPD process is at a very early stage ; relatively few applications have reached the stage of full commercial production . While the most well known and widespread of these applications ...
... APPLICATIONS The development of applications for the CAPD process is at a very early stage ; relatively few applications have reached the stage of full commercial production . While the most well known and widespread of these applications ...
Page 366
... Applications " ( B. Blewer , ed . ) . The Materials Research Society , Pittsburgh " Pennsylvania " , 1986 ; ( b ) “ Tungsten and Other Refractory Metals for VLSI Applications II " ( E. Broadbent , ed . ) . The Materials Research Society ...
... Applications " ( B. Blewer , ed . ) . The Materials Research Society , Pittsburgh " Pennsylvania " , 1986 ; ( b ) “ Tungsten and Other Refractory Metals for VLSI Applications II " ( E. Broadbent , ed . ) . The Materials Research Society ...
Contents
Processing Plasmas | 16 |
rf Diode Plasmas | 24 |
Afterglow Plasmas | 37 |
Copyright | |
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alloy anode Appl applications AsH3 atoms chamber chemical chemical vapor deposition coatings composition compound Crystal Growth density deposition process deposition rate device dielectric dopant doping effects Electrochem emission epitaxial etch rate evaporation excitation film deposition flow flux GaAs gas-phase gases glow discharge grid growth rate heater heating increase ion beam ion bombardment ion energy ion source ionization kinetic laser layer Lett LPCVD magnetic field magnetron material metal molecules nitride OMVPE optical oxide particle PECVD photochemical photodeposition photon photoresist Phys plasma plasma etching potential precursor pressure Proc produce pump ratio reactants reaction reactor region remote PECVD semiconductor shown in Fig SiH4 silane silicon silicon nitride SiO2 sol-gel species sputter deposition sputtering stoichiometric substrate substrate temperature surface susceptor target techniques Technol Technology thermal thickness thin film Thin Solid Films tion torr typically vacuum voltage wafer wavelength