Thin Film Processes, Volume 2 |
From inside the book
Results 1-3 of 97
Page 22
At very low discharge currents , the glow will not cover all regions of the cathode .
This is called the normal discharge . As the discharge is increased , by small
increases in voltage , the coverage of the cathode increases . Eventually , the
entire ...
At very low discharge currents , the glow will not cover all regions of the cathode .
This is called the normal discharge . As the discharge is increased , by small
increases in voltage , the coverage of the cathode increases . Eventually , the
entire ...
Page 52
This type of magnetron is well suited to manufacturing applications . By making
the long dimension of the racetrack somewhat longer than the dimensions of the
sample , films can be sputtered onto the sample ( from the cathode ) with a simple
...
This type of magnetron is well suited to manufacturing applications . By making
the long dimension of the racetrack somewhat longer than the dimensions of the
sample , films can be sputtered onto the sample ( from the cathode ) with a simple
...
Page 70
A hollow cathode electron source , shown with an insert within the tip for cooler
operation . The keeper is a local anode often used to sustain the discharge .
moderately energetic electrons for plasmas . As shown in Fig . 59 , the hollow
cathode ...
A hollow cathode electron source , shown with an insert within the tip for cooler
operation . The keeper is a local anode often used to sustain the discharge .
moderately energetic electrons for plasmas . As shown in Fig . 59 , the hollow
cathode ...
What people are saying - Write a review
We haven't found any reviews in the usual places.
Contents
ROSSNAGEL | 12 |
rf Diode Plasmas | 24 |
Plasmas in the Presence of Magnetic Fields | 39 |
Copyright | |
25 other sections not shown
Other editions - View all
Common terms and phrases
addition alloy Appl applications atoms beam cathode chamber charge chemical coatings composition compound contamination Crystal density dependent deposition rate developed device direct discharge discussed effects electric Electrochem electron energy epitaxial etching evaporation example excitation film deposition flow flux formation function GaAs gases geometry growth heating higher important increase ionization laser layer lead Lett limited lower magnetic field magnetron material measured mechanism metal method observed obtained occurs operation optical oxide particle PECVD phase Phys Physics plasma potential precursor present pressure produce properties pump range ratio reaction reactive reactor reduced region relatively resistivity sample selective semiconductor shown silicon similar SiO2 Solid species sputtering structure studies substrate surface techniques Technol Technology temperature thermal thickness thin film tion typically uniformity vacuum voltage wafer