Thin Film Processes, Volume 2John L. Vossen, Werner Kern Academic Press, 1978 - Thin films |
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Page 91
... Electroplated W spiral Sublimitation Embedded W heater Resistance heater Embedded W heater Alloys with W , Ta , Mo , Cb , Pt . Evaporant weight must not exceed 35 % of that of W spiral . Refractory metal used as a source material ...
... Electroplated W spiral Sublimitation Embedded W heater Resistance heater Embedded W heater Alloys with W , Ta , Mo , Cb , Pt . Evaporant weight must not exceed 35 % of that of W spiral . Refractory metal used as a source material ...
Page 265
... electroplating and as an alternative to pre- cious - metal coatings . The potential of the process in erosion and corrosion protection situations is at an advance stage of study and development , while the exploration of electronic and ...
... electroplating and as an alternative to pre- cious - metal coatings . The potential of the process in erosion and corrosion protection situations is at an advance stage of study and development , while the exploration of electronic and ...
Page 447
... electroplating Fig . 2. Schematic representations of the various methods available for the laser - assisted deposition of films . The darkened rectangles represent substrates that absorb strongly at the laser wavelength , whereas the ...
... electroplating Fig . 2. Schematic representations of the various methods available for the laser - assisted deposition of films . The darkened rectangles represent substrates that absorb strongly at the laser wavelength , whereas the ...
Contents
Processing Plasmas | 16 |
rf Diode Plasmas | 24 |
Afterglow Plasmas | 37 |
Copyright | |
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alloy anode Appl applications AsH3 atoms chamber chemical chemical vapor deposition coatings composition compound Crystal Growth density deposition process deposition rate device dielectric dopant doping effects Electrochem emission epitaxial etch rate evaporation excitation film deposition flow flux GaAs gas-phase gases glow discharge grid growth rate heater heating increase ion beam ion bombardment ion energy ion source ionization kinetic laser layer Lett LPCVD magnetic field magnetron material metal molecules nitride OMVPE optical oxide particle PECVD photochemical photodeposition photon photoresist Phys plasma plasma etching potential precursor pressure Proc produce pump ratio reactants reaction reactor region remote PECVD semiconductor shown in Fig SiH4 silane silicon silicon nitride SiO2 sol-gel species sputter deposition sputtering stoichiometric substrate substrate temperature surface susceptor target techniques Technol Technology thermal thickness thin film Thin Solid Films tion torr typically vacuum voltage wafer wavelength