Thin Film Processes, Volume 2John L. Vossen, Werner Kern Academic Press, 1978 - Thin films |
From inside the book
Results 1-3 of 19
Page 764
... photoresist pattern . The portion of the photoresist that is at the optimum angle for etching will grow at the expense of other portions resulting in the formation of a facet ( Fig . 3 ) . If this facet is permitted to grow to a large ...
... photoresist pattern . The portion of the photoresist that is at the optimum angle for etching will grow at the expense of other portions resulting in the formation of a facet ( Fig . 3 ) . If this facet is permitted to grow to a large ...
Page 765
... photoresist masks is to have walls with a positive slope ( Fig . 4a ) , rather than vertical or undercut walls . A ... photoresist is common for IBE masks . There are many types of photoresist , with AZ 1350H and Kodak 5214 among the ...
... photoresist masks is to have walls with a positive slope ( Fig . 4a ) , rather than vertical or undercut walls . A ... photoresist is common for IBE masks . There are many types of photoresist , with AZ 1350H and Kodak 5214 among the ...
Page 793
... photoresists in conventional , i.e. , nonlaser , photolithographic processes . Patterned photoresist films on a substrate surface are an example of con- tact masking for subsequent processing steps . Virtually all indirect , i.e. , two ...
... photoresists in conventional , i.e. , nonlaser , photolithographic processes . Patterned photoresist films on a substrate surface are an example of con- tact masking for subsequent processing steps . Virtually all indirect , i.e. , two ...
Other editions - View all
Common terms and phrases
alloy anode Appl applications AsH3 atoms cathode chamber chemical chemical vapor deposition coatings composition compound semiconductors compounds Crystal Growth CVD reactors density deposition process deposition rate device dielectric diffusion dopant doping effects Electrochem electron emission epitaxial etch rate film deposition flux GaAs gas-phase gases glow discharge grid growth rate heating increase ion beam ion bombardment ion energy ion source ionization K. F. Jensen kinetics laser layer Lett LPCVD magnetic field magnetron material metal mtorr nitride nucleation OMVPE optical oxide particle PECVD photochemical photodeposition photoresist Phys plasma plasma etching potential precursor pressure Proc produce pump ratio reactants reactive region remote PECVD semiconductor SiH4 silane silicides silicon silicon nitride SiO2 sol-gel species sputter deposition sputtering substrate substrate temperature susceptor target techniques Technol Technology thermal thin films Thin Solid Films tion torr typically vacuum voltage wafer wavelength