Thin Film Processes, Volume 2John L. Vossen, Werner Kern Academic Press, 1978 - Thin films |
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Page 87
... VACUUM BEAM VACUUM PUMPING PUMPING SEAL STAGES PROCESS SEAL STAGES COOL REWIND Fig . 3. A schematic representation of a 24 - inch semicontinuous high - vacuum strip pro- cessing line . To vacuum pump Water outlet : Drain outlet CWater ...
... VACUUM BEAM VACUUM PUMPING PUMPING SEAL STAGES PROCESS SEAL STAGES COOL REWIND Fig . 3. A schematic representation of a 24 - inch semicontinuous high - vacuum strip pro- cessing line . To vacuum pump Water outlet : Drain outlet CWater ...
Page 218
... vacuum arc is a paradox because , if a vacuum exists , there can be no arc , and vice versa . The term vacuum arc , as employed here , means an arc sustained by material originating from a cathode in an environment that would otherwise ...
... vacuum arc is a paradox because , if a vacuum exists , there can be no arc , and vice versa . The term vacuum arc , as employed here , means an arc sustained by material originating from a cathode in an environment that would otherwise ...
Page 777
... vacuum is poor . In atmosphere , the air and adsorbed layers of water vapor and hydrocarbons provide good thermal contact between parts that are bolted or otherwise fastened together . In a vacuum , the thermal conduction is limited to ...
... vacuum is poor . In atmosphere , the air and adsorbed layers of water vapor and hydrocarbons provide good thermal contact between parts that are bolted or otherwise fastened together . In a vacuum , the thermal conduction is limited to ...
Contents
Processing Plasmas | 16 |
rf Diode Plasmas | 24 |
Afterglow Plasmas | 37 |
Copyright | |
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alloy anode Appl applications AsH3 atoms chamber chemical chemical vapor deposition coatings composition compound Crystal Growth density deposition process deposition rate device dielectric dopant doping effects Electrochem emission epitaxial etch rate evaporation excitation film deposition flow flux GaAs gas-phase gases glow discharge grid growth rate heater heating increase ion beam ion bombardment ion energy ion source ionization kinetic laser layer Lett LPCVD magnetic field magnetron material metal molecules nitride OMVPE optical oxide particle PECVD photochemical photodeposition photon photoresist Phys plasma plasma etching potential precursor pressure Proc produce pump ratio reactants reaction reactor region remote PECVD semiconductor shown in Fig SiH4 silane silicon silicon nitride SiO2 sol-gel species sputter deposition sputtering stoichiometric substrate substrate temperature surface susceptor target techniques Technol Technology thermal thickness thin film Thin Solid Films tion torr typically vacuum voltage wafer wavelength