## Principles of Plasma Discharges and Materials ProcessingA Thorough Update of the Industry Classic on Principles of Plasma Processing The first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals. The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in-depth coverage of the fundamentals of plasma physics and chemistry, the authors apply basic theory to plasma discharges, including calculations of plasma parameters and the scaling of plasma parameters with control parameters. New and expanded topics include: * Updated cross sections * Diffusion and diffusion solutions * Generalized Bohm criteria * Expanded treatment of dc sheaths * Langmuir probes in time-varying fields * Electronegative discharges * Pulsed power discharges * Dual frequency discharges * High-density rf sheaths and ion energy distributions * Hysteresis and instabilities * Helicon discharges * Hollow cathode discharges * Ionized physical vapor deposition * Differential substrate charging With new chapters on dusty plasmas and the kinetic theory of discharges, graduate students and researchers in the field of plasma processing should find this new edition more valuable than ever. |

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### Contents

1 | |

2 BASIC PLASMA EQUATIONS AND EQUILIBRIUM | 23 |

3 ATOMIC COLLISIONS | 43 |

4 PLASMA DYNAMICS | 87 |

5 DIFFUSION AND TRANSPORT | 133 |

6 DIRECT CURRENT DC SHEATHS | 165 |

7 CHEMICAL REACTIONS AND EQUILIBRIUM | 207 |

8 MOLECULAR COLLISIONS | 235 |

13 WAVEHEATED DISCHARGES | 491 |

14 DIRECT CURRENT DC DISCHARGES | 535 |

15 ETCHING | 571 |

16 DEPOSITION AND IMPLANTATION | 619 |

17 DUSTY PLASMAS | 649 |

18 KINETIC THEORY OF DISCHARGES | 679 |

APPENDIX A COLLISION DYNAMICS | 723 |

APPENDIX B THE COLLISION INTEGRAL | 727 |

### Other editions - View all

Principles of Plasma Discharges and Materials Processing Michael A. Lieberman,Alan J. Lichtenberg No preview available - 2005 |

Principles of Plasma Discharges and Materials Processing Michael A. Lieberman,Alan J. Lichtenberg No preview available - 2005 |

### Common terms and phrases

ambipolar anisotropic approximation argon assume Boltzmann relation bulk plasma calculation capacitive discharge cathode Chapter charge chemisorption collision collisional collisionless conﬁguration cross section Debye length deﬁned deposition determine diffusion coefﬁcient dissociation distribution elastic collision electric ﬁeld electron density electron temperature electronegative electropositive emission enthalpy equation equilibrium etch rate etchant example excitation F atoms ﬁlm ﬁnd ﬁrst ﬁxed ﬂow ﬂux frequency given helicon helicon discharges Hence increase integrating ion density ion energy ion ﬂux ionization kinetic Langmuir probe Lieberman low pressures magnetic ﬁeld Maxwellian mean free path metastable molecules mTorr negative ion neutral obtain ohmic heating oscillating oxide parameters particle photoresist physisorption plasma density positive ion potential probe proﬁle radius rate constant ratio reaction recombination regime region resonance scattering sheath edge shown in Figure signiﬁcant silicon skin depth solution species sputter deposition sputtering stochastic heating substrate surface thermal typical velocity versus voltage wave yields