Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 47
... first ionization potential of the sputtered atom is less than that of the metastable energy . Since the metastable energies of the noble gases are greater than the first ionization potential of most elements , this mechanism can produce ...
... first ionization potential of the sputtered atom is less than that of the metastable energy . Since the metastable energies of the noble gases are greater than the first ionization potential of most elements , this mechanism can produce ...
Page 95
... first cycloidal orbit and are lost at the cathode ( Section II.G ) , or if after entering the trap , they escape with- out producing the required ionization . The latter action causes the abrupt voltage increase shown at A in Fig . 11 ...
... first cycloidal orbit and are lost at the cathode ( Section II.G ) , or if after entering the trap , they escape with- out producing the required ionization . The latter action causes the abrupt voltage increase shown at A in Fig . 11 ...
Page 520
... first patterned using a resist mask , prior to conversion from Ar ion etching to Ar / O2 etching . Examples of this technique include the sputter etching of Au me- tallizations using Ni [ 48 ] and Ti [ 44 ] masks . It should be noted ...
... first patterned using a resist mask , prior to conversion from Ar ion etching to Ar / O2 etching . Examples of this technique include the sputter etching of Au me- tallizations using Ni [ 48 ] and Ti [ 44 ] masks . It should be noted ...
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Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York