Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 37
... absorption spectroscopies [ 162-168 ] , but they must be independently calibrated . These same spectroscopies along with mass spectroscopy are also useful for diagnosing glow discharge species of all kinds ( ions , neutrals , molecu ...
... absorption spectroscopies [ 162-168 ] , but they must be independently calibrated . These same spectroscopies along with mass spectroscopy are also useful for diagnosing glow discharge species of all kinds ( ions , neutrals , molecu ...
Page 356
... absorption and index of refraction measurements . Thus , these oxides were formed with indices ( and presumably densities ) very close to their thermal counterparts . 3. Plasma Oxides by Anodization Plasma anodization is the formation ...
... absorption and index of refraction measurements . Thus , these oxides were formed with indices ( and presumably densities ) very close to their thermal counterparts . 3. Plasma Oxides by Anodization Plasma anodization is the formation ...
Page 549
... absorption for x rays of the gold . Positive ions impinging directly onto the gate oxide can cause dielectric breakdown or produce mobile charge , fixed interface charge , or interface trapping states . Dielectric breakdown is ...
... absorption for x rays of the gold . Positive ions impinging directly onto the gate oxide can cause dielectric breakdown or produce mobile charge , fixed interface charge , or interface trapping states . Dielectric breakdown is ...
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Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York