Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 228
... alloys , the plate is nonadherent . In fact , the H2 evolution is often suffi- cient to blow the Sn deposit off the substrate ; but with the particular alloys used for pistons , the deposit is adherent , and somewhat thicker than usual ...
... alloys , the plate is nonadherent . In fact , the H2 evolution is often suffi- cient to blow the Sn deposit off the substrate ; but with the particular alloys used for pistons , the deposit is adherent , and somewhat thicker than usual ...
Page 246
... alloys are plated , usually to modify the proper- ties of the deposit with regard to color , hardness , wear resistance , and other properties considered important for the application . Most electrodeposited alloys have the same ...
... alloys are plated , usually to modify the proper- ties of the deposit with regard to color , hardness , wear resistance , and other properties considered important for the application . Most electrodeposited alloys have the same ...
Page 248
... alloy deposits are of considerable impor- tance . Most of these are binary alloys , since the complications in control of the composition of higher - order alloys have discouraged their applica- tion . An exception is the Cu - Sn - Zn alloy ...
... alloy deposits are of considerable impor- tance . Most of these are binary alloys , since the complications in control of the composition of higher - order alloys have discouraged their applica- tion . An exception is the Cu - Sn - Zn alloy ...
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Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York