Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 176
... BEAM SUBSTRATE SPUTTERED MATERIAL TARGET EXTRACTOR ION BEAM ION SOURCE ( b ) Fig . 1. Ion beam deposition configurations . ( a ) Primary ion beam deposition , with ion beam deposited directly onto substrate , ( b ) secondary ion beam ...
... BEAM SUBSTRATE SPUTTERED MATERIAL TARGET EXTRACTOR ION BEAM ION SOURCE ( b ) Fig . 1. Ion beam deposition configurations . ( a ) Primary ion beam deposition , with ion beam deposited directly onto substrate , ( b ) secondary ion beam ...
Page 186
... Beam Transport Beam deflection is accomplished by transverse electric fields [ 42 ] and mass separation by magnetic fields [ 43 ] . If mass separation is desired with a straight trajectory , crossed electric and magnetic fields will ...
... Beam Transport Beam deflection is accomplished by transverse electric fields [ 42 ] and mass separation by magnetic fields [ 43 ] . If mass separation is desired with a straight trajectory , crossed electric and magnetic fields will ...
Page 200
... beam will also sputter the growing film , changing the deposition rate and modifying the properties of the film [ 72 ] . If beam purity is critical , mass separation may be carried out [ 31 ] . Neu- trals which form in the beam may be ...
... beam will also sputter the growing film , changing the deposition rate and modifying the properties of the film [ 72 ] . If beam purity is critical , mass separation may be carried out [ 31 ] . Neu- trals which form in the beam may be ...
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Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York