Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 558
... Chemical vapor deposition reactions , tables metal , 317 metal alloy , 317 semiconductor group II - VI , 313 group III - V , 311 group IV , 310 Circular magnetron , see S - gun magnetron ; sputter gun magnetron Cladding , 4 explosive ...
... Chemical vapor deposition reactions , tables metal , 317 metal alloy , 317 semiconductor group II - VI , 313 group III - V , 311 group IV , 310 Circular magnetron , see S - gun magnetron ; sputter gun magnetron Cladding , 4 explosive ...
Page 561
... chemical vapor dep- osition , 260 , 261 , 272–274 , 292 Masking material , 408-410 Metal , chemical vapor deposition , 315-317 Metal alloy chemical etching , 432 chemical vapor deposition , 315-317 tables of etchants for , 477-478 elemental ...
... chemical vapor dep- osition , 260 , 261 , 272–274 , 292 Masking material , 408-410 Metal , chemical vapor deposition , 315-317 Metal alloy chemical etching , 432 chemical vapor deposition , 315-317 tables of etchants for , 477-478 elemental ...
Page 563
... deposition , 175–176 , 189-198 Secondary ion emission , 17-19 Semiconductor chemical etching , 424-432 , 438-462 chemical vapor deposition , 309–315 compound chemical etching , 430-432 , 451-462 elemental chemical etching , 424-430 ...
... deposition , 175–176 , 189-198 Secondary ion emission , 17-19 Semiconductor chemical etching , 424-432 , 438-462 chemical vapor deposition , 309–315 compound chemical etching , 430-432 , 451-462 elemental chemical etching , 424-430 ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min