Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 82
... electric field is nonuniform . However , for a planar cath- ode the distance d , to the turning point is given by Eq . ( 6 ) , with W equal to the total energy which the electrons have gained from the electric field in passing to the ...
... electric field is nonuniform . However , for a planar cath- ode the distance d , to the turning point is given by Eq . ( 6 ) , with W equal to the total energy which the electrons have gained from the electric field in passing to the ...
Page 230
... electrical forces between the ions ( in- terionic attraction ) render this simple assumption untenable unless the so ... electric current is proportional to the quantity of electricity that passes . 2. The amounts of different substances ...
... electrical forces between the ions ( in- terionic attraction ) render this simple assumption untenable unless the so ... electric current is proportional to the quantity of electricity that passes . 2. The amounts of different substances ...
Page 368
... Electric Discharge Electric power sources with frequencies in the 0 ( dc ) to gigahertz ( mi- crowave ) range can be used for glow discharge polymerization . The use of a low frequency electric power source ( up to about 368 H. YASUDA.
... Electric Discharge Electric power sources with frequencies in the 0 ( dc ) to gigahertz ( mi- crowave ) range can be used for glow discharge polymerization . The use of a low frequency electric power source ( up to about 368 H. YASUDA.
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min