Thin Film Processes, Volume 1
John L. Vossen, Werner Kern
Academic Press, 1978 - Technology & Engineering - 564 pages
Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process.
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Glow Discharge Sputter Deposition
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addition alloys anode Appl applications atoms cathode charge chemical coatings composition compounds concentration constant containing density dependent deposition rate effect electric Electrochem electron energy Epitaxial etch rate etchants example factor flow formation gases given glass glow discharge heating higher important increase ion beam ionization layer less limited lower magnetic field magnetron material metal method negative nitride occurs operation oxide pattern Phys plasma plating polishing polymer polymerization positive potential prepared pressure produce properties range ratio reaction reactive reactor reducing Reference region relatively resistance semiconductor shown in Fig silicon solution species sputtering starting structure substrate surface Table target techniques Technol temperature thermal thickness Thin Thin Film tion typically um/min uniform usually vacuum vapor various voltage yield York