Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Results 1-3 of 22
Page 271
... experiments , again presenting those conducted in our laboratories as examples . 2. Experimental Studies of Transport Phenomena in Cold - Wall CVD Reactors a . Flow Visualization . In these studies [ 55 , 61 , 62 ] , TiO2 smoke was em ...
... experiments , again presenting those conducted in our laboratories as examples . 2. Experimental Studies of Transport Phenomena in Cold - Wall CVD Reactors a . Flow Visualization . In these studies [ 55 , 61 , 62 ] , TiO2 smoke was em ...
Page 337
... EXPERIMENTAL REQUIREMENTS AND TECHNIQUES A. Dominant Plasma Parameters Anyone becoming familiar with plasma thin film deposition processes will realize that there are as many deposition reactor designs and experi- mental conditions to ...
... EXPERIMENTAL REQUIREMENTS AND TECHNIQUES A. Dominant Plasma Parameters Anyone becoming familiar with plasma thin film deposition processes will realize that there are as many deposition reactor designs and experi- mental conditions to ...
Page 513
... experimental point of view . However , recently several workers [ 40 ] , and in particular Sigmund [ 41 ] , have correlated these data with the development of a theoretical under- standing of the processes involved in ion etching . A ...
... experimental point of view . However , recently several workers [ 40 ] , and in particular Sigmund [ 41 ] , have correlated these data with the development of a theoretical under- standing of the processes involved in ion etching . A ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min