Thin Film Processes, Volume 1Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Wire flame spraying ( 32 , 50 , 51 ] 18 . Powder flame spraying [ 32 , 51 , 52 ] 19 .
Plasma flame spraying ( 32 , 51 , 53 ] 20 . Arc plasma spraying ( 54 - 57 ] 21 .
Detonation coating ( 58 ] 22 . Diffusion coating [ 32 , 59 , 60 ] 23 . Pack
cementation ...
Wire flame spraying ( 32 , 50 , 51 ] 18 . Powder flame spraying [ 32 , 51 , 52 ] 19 .
Plasma flame spraying ( 32 , 51 , 53 ] 20 . Arc plasma spraying ( 54 - 57 ] 21 .
Detonation coating ( 58 ] 22 . Diffusion coating [ 32 , 59 , 60 ] 23 . Pack
cementation ...
Page 7
H . S . Ingham and A . P . Shepard , “ Flame Spray Handbook , " Vol . 1 : Wire
Flame Spraying . Metco , New York , 1965 . 51 . C . W . Smith , in “ Science and
Technology of Surface Coating " ( B . N . Chapman and J . C . Anderson , eds . ) ,
p .
H . S . Ingham and A . P . Shepard , “ Flame Spray Handbook , " Vol . 1 : Wire
Flame Spraying . Metco , New York , 1965 . 51 . C . W . Smith , in “ Science and
Technology of Surface Coating " ( B . N . Chapman and J . C . Anderson , eds . ) ,
p .
Page 370
They are particularly suited for the utilization of the tail - flame portion of the glow
discharge . The tailflame refers to the glow discharge away from the energy input
region ( under external electrodes or coil ) . Whether a substrate is placed in the ...
They are particularly suited for the utilization of the tail - flame portion of the glow
discharge . The tailflame refers to the glow discharge away from the energy input
region ( under external electrodes or coil ) . Whether a substrate is placed in the ...
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Contents
Glow Discharge Sputter Deposition | 12 |
Glow Discharges | 24 |
Equipment Configuration | 31 |
Copyright | |
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Common terms and phrases
addition alloys anode Appl applications atoms cathode charge chemical coatings composition compounds concentration constant containing density dependent deposition rate effect electric Electrochem electron energy Epitaxial etch rate etchants example factor flow formation gases given glass glow discharge heating higher important increase ion beam ionization layer less limited lower magnetic field magnetron material metal method negative nitride occurs operation oxide pattern Phys plasma plating polishing polymer polymerization positive potential prepared pressure produce properties range ratio reaction reactive reactor reducing Reference region relatively resistance semiconductor shown in Fig silicon solution species sputtering starting structure substrate surface Table target techniques Technol temperature thermal thickness Thin Thin Film tion typically um/min uniform usually vacuum vapor various voltage yield York
Bibliographic information
| Title | Thin Film Processes, Volume 1 Thin Film Processes, John L. Vossen |
| Editors | John L. Vossen, Werner Kern |
| Contributor | Elsevier Science & Technology (Firm) |
| Edition | 8, illustrated |
| Publisher | Academic Press, 1978 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 0127282505, 9780127282503 |
| Length | 564 pages |
| Subjects | › Technology & Engineering / General |
| Export Citation | BiBTeX EndNote RefMan |