Thin film processes, Volume 1Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 370
1) in which the substrate material also plays an important role in glow discharge
polymerization. B. Flow Rate The flow rate in most cases of glow discharge
polymerization simply refers to the feeding-in rate of the starting materials into the
total ...
1) in which the substrate material also plays an important role in glow discharge
polymerization. B. Flow Rate The flow rate in most cases of glow discharge
polymerization simply refers to the feeding-in rate of the starting materials into the
total ...
Page 383
Flow Rate The polymer deposition rate increases linearly with the flow rate of a
starting material under ideal conditions where the conversion ratio of starting
material to polymer is high or remains at a constant level. However, the change of
...
Flow Rate The polymer deposition rate increases linearly with the flow rate of a
starting material under ideal conditions where the conversion ratio of starting
material to polymer is high or remains at a constant level. However, the change of
...
Page 533
It has been tacitly assumed in the preceding discussion that power and pressure
mainly affect the generation rate of active ... Flow Rate Plasma etching is
normally done under dynamic flow to replenish continually the reactant species
and ...
It has been tacitly assumed in the preceding discussion that power and pressure
mainly affect the generation rate of active ... Flow Rate Plasma etching is
normally done under dynamic flow to replenish continually the reactant species
and ...
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Contents
Glow Discharge Sputter Deposition | 12 |
Glow Discharges | 24 |
Equipment Configuration | 31 |
Copyright | |
8 other sections not shown
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Common terms and phrases
A/min Abstr alloys anode Appl applications argon atoms bias cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial Epitaxial Epitaxial Epitaxial etch rate etchant etching processes film deposition flow rate GaAs gases glow discharge polymerization heating increase ion beam deposition ion source ionization Kern layer magnetic field magnetron mask metal mTorr operation oxide photoresist Phys plasma etching plating PM sputtering polishing polymer polymer deposition potential power density power supply pressure Proc produce ratio RCA Rev reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon nitride solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York
Bibliographic information
| Title | Thin film processes, Volume 1 Thin Film Processes, Werner Kern |
| Author | John L. Vossen |
| Editors | John L. Vossen, Werner Kern |
| Edition | 8, illustrated |
| Publisher | Academic Press, 1978 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 0127282505, 9780127282503 |
| Length | 564 pages |
| Subjects | › › Technology & Engineering / Electronics / General Technology & Engineering / General Technology & Engineering / Materials Science Thin films |
| Export Citation | BiBTeX EndNote RefMan |