Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 362
... glow discharge polymeriza- tion . The recognition of thin film formation by glow discharge polymeriza- tion can be traced back to 1874 [ 1 , 2 ] . However , in most cases the poly- mers were considered as by - products of an electric ...
... glow discharge polymeriza- tion . The recognition of thin film formation by glow discharge polymeriza- tion can be traced back to 1874 [ 1 , 2 ] . However , in most cases the poly- mers were considered as by - products of an electric ...
Page 363
... glow dis- charge - although such polymerization may play a role , depending on the chemical structure of a monomer and also on the conditions of the glow discharge . In contrast to conventional polymerization - i.e . , molecular polymer ...
... glow dis- charge - although such polymerization may play a role , depending on the chemical structure of a monomer and also on the conditions of the glow discharge . In contrast to conventional polymerization - i.e . , molecular polymer ...
Page 373
... Discharge Power The significance of discharge power in glow discharge polymerization is quite different from that for nonpolymer - forming plasmas . In essence , ( the absolute value of ) discharge power itself cannot be considered as ...
... Discharge Power The significance of discharge power in glow discharge polymerization is quite different from that for nonpolymer - forming plasmas . In essence , ( the absolute value of ) discharge power itself cannot be considered as ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min