Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 362
... glow discharge polymeriza- tion . The recognition of thin film formation by glow discharge polymeriza- tion can be traced back to 1874 [ 1 , 2 ] . However , in most cases the poly- mers were considered as by - products of an electric ...
... glow discharge polymeriza- tion . The recognition of thin film formation by glow discharge polymeriza- tion can be traced back to 1874 [ 1 , 2 ] . However , in most cases the poly- mers were considered as by - products of an electric ...
Page 363
... glow dis- charge - although such polymerization may play a role , depending on the chemical structure of a monomer and also on the conditions of the glow discharge . In contrast to conventional polymerization - i.e . , molecular polymer ...
... glow dis- charge - although such polymerization may play a role , depending on the chemical structure of a monomer and also on the conditions of the glow discharge . In contrast to conventional polymerization - i.e . , molecular polymer ...
Page 373
... Discharge Power The significance of discharge power in glow discharge polymerization is quite different from that for nonpolymer - forming plasmas . In essence , ( the absolute value of ) discharge power itself cannot be considered as ...
... Discharge Power The significance of discharge power in glow discharge polymerization is quite different from that for nonpolymer - forming plasmas . In essence , ( the absolute value of ) discharge power itself cannot be considered as ...
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Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York