Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 37
... Heaters Given the fact that there is heat input to substrates from the glow dis- charge , control of substrate ... heater can be used either to heat sub- strates in the holder shown directly or to heat a solid plate which has a W ...
... Heaters Given the fact that there is heat input to substrates from the glow dis- charge , control of substrate ... heater can be used either to heat sub- strates in the holder shown directly or to heat a solid plate which has a W ...
Page 142
... heaters ; the close source - substrate dis- tance typically used in PM sputtering prevents uniform surface heating during deposition by a conventional quartz - lamp radiant heater array . In an in - line system , radiant heaters can be ...
... heaters ; the close source - substrate dis- tance typically used in PM sputtering prevents uniform surface heating during deposition by a conventional quartz - lamp radiant heater array . In an in - line system , radiant heaters can be ...
Page 281
... heater ( Fig . 9b ) . The reaction chamber consists of a cylindrical , conical , or hemispherical bell jar that may have provisions for cooling . The gases enter through single or multiple inlets from the top or side of the bell jar ...
... heater ( Fig . 9b ) . The reaction chamber consists of a cylindrical , conical , or hemispherical bell jar that may have provisions for cooling . The gases enter through single or multiple inlets from the top or side of the bell jar ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min