Thin Film Processes, Volume 1Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 105
The substrate heating is much reduced in magnetrons by the absence of plasma
bombardment . Thus plastics , including heat - sensitive membranes , have been
effectively coated with metals by using cylindrical - post magnetrons ( 103 ) .
The substrate heating is much reduced in magnetrons by the absence of plasma
bombardment . Thus plastics , including heat - sensitive membranes , have been
effectively coated with metals by using cylindrical - post magnetrons ( 103 ) .
Page 142
If constant uniform heat is necessary , radiant surface preheating combined with
some type of backside substrate carrier ... In any substrate heating arrangement it
is difficult to avoid heating extraneous portions of the deposition chamber and ...
If constant uniform heat is necessary , radiant surface preheating combined with
some type of backside substrate carrier ... In any substrate heating arrangement it
is difficult to avoid heating extraneous portions of the deposition chamber and ...
Page 168
deposition to promote surface diffusion of the Al in order to achieve adequate
step coverage ; heating , however , increases the likelihood of mobile ion
contamination . Electron - beam evaporators have been retrofitted with single or
multiple ...
deposition to promote surface diffusion of the Al in order to achieve adequate
step coverage ; heating , however , increases the likelihood of mobile ion
contamination . Electron - beam evaporators have been retrofitted with single or
multiple ...
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Contents
Glow Discharge Sputter Deposition | 12 |
Glow Discharges | 24 |
Equipment Configuration | 31 |
Copyright | |
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Common terms and phrases
addition alloys anode Appl applications atoms cathode charge chemical coatings composition compounds concentration constant containing density dependent deposition rate effect electric Electrochem electron energy Epitaxial etch rate etchants example factor flow formation gases given glass glow discharge heating higher important increase ion beam ionization layer less limited lower magnetic field magnetron material metal method negative nitride occurs operation oxide pattern Phys plasma plating polishing polymer polymerization positive potential prepared pressure produce properties range ratio reaction reactive reactor reducing Reference region relatively resistance semiconductor shown in Fig silicon solution species sputtering starting structure substrate surface Table target techniques Technol temperature thermal thickness Thin Thin Film tion typically um/min uniform usually vacuum vapor various voltage yield York
Bibliographic information
| Title | Thin Film Processes, Volume 1 Thin Film Processes, John L. Vossen |
| Editors | John L. Vossen, Werner Kern |
| Contributor | Elsevier Science & Technology (Firm) |
| Edition | 8, illustrated |
| Publisher | Academic Press, 1978 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 0127282505, 9780127282503 |
| Length | 564 pages |
| Subjects | › Technology & Engineering / General |
| Export Citation | BiBTeX EndNote RefMan |