Thin film processes, Volume 1Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 105
The substrate heating is much reduced in magnetrons by the absence of plasma
bombardment. Thus plastics, including heat-sensitive membranes, have been
effectively coated with metals by using cylindrical-post magnetrons [103].
The substrate heating is much reduced in magnetrons by the absence of plasma
bombardment. Thus plastics, including heat-sensitive membranes, have been
effectively coated with metals by using cylindrical-post magnetrons [103].
Page 142
Substrate Heating Substrate heating poses a problem in PM sputtering. Tubular
quartz lamps are often used as radiant heaters; the close source-substrate
distance typically used in PM sputtering prevents uniform surface heating during
...
Substrate Heating Substrate heating poses a problem in PM sputtering. Tubular
quartz lamps are often used as radiant heaters; the close source-substrate
distance typically used in PM sputtering prevents uniform surface heating during
...
Page 168
deposition to promote surface diffusion of the Al in order to achieve adequate
step coverage; heating, however, increases the likelihood of mobile ion
contamination. Electron-beam evaporators have been retrofitted with single or
multiple ...
deposition to promote surface diffusion of the Al in order to achieve adequate
step coverage; heating, however, increases the likelihood of mobile ion
contamination. Electron-beam evaporators have been retrofitted with single or
multiple ...
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Contents
Glow Discharge Sputter Deposition | 12 |
Glow Discharges | 24 |
Equipment Configuration | 31 |
Copyright | |
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Common terms and phrases
A/min Abstr alloys anode Appl applications argon atoms bias cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial Epitaxial Epitaxial Epitaxial etch rate etchant etching processes film deposition flow rate GaAs gases glow discharge polymerization heating increase ion beam deposition ion source ionization Kern layer magnetic field magnetron mask metal mTorr operation oxide photoresist Phys plasma etching plating PM sputtering polishing polymer polymer deposition potential power density power supply pressure Proc produce ratio RCA Rev reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon nitride solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York
Bibliographic information
| Title | Thin film processes, Volume 1 Thin Film Processes, Werner Kern |
| Author | John L. Vossen |
| Editors | John L. Vossen, Werner Kern |
| Edition | 8, illustrated |
| Publisher | Academic Press, 1978 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 0127282505, 9780127282503 |
| Length | 564 pages |
| Subjects | › › Technology & Engineering / Electronics / General Technology & Engineering / General Technology & Engineering / Materials Science Thin films |
| Export Citation | BiBTeX EndNote RefMan |