Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 12
... interactions of the process parameters to expose the many permutations and combinations that are available to control the properties of thin films . Because there are so many interactions among parameters in sputter- ing systems , it is ...
... interactions of the process parameters to expose the many permutations and combinations that are available to control the properties of thin films . Because there are so many interactions among parameters in sputter- ing systems , it is ...
Page 14
... interaction phenomena in- volved that contribute to the yield of a given surface are not completely understood . Despite this , an impressive body of literature exists showing the yield to be related to momentum transfer from energetic ...
... interaction phenomena in- volved that contribute to the yield of a given surface are not completely understood . Despite this , an impressive body of literature exists showing the yield to be related to momentum transfer from energetic ...
Page 312
... interaction with the appropriate metals ; ( 2 ) the chloride method where group V trichlorides interact with the appropriate III - V compound or group III metal ; ( 3 ) the organometallic method where group III elements are intro- duced ...
... interaction with the appropriate metals ; ( 2 ) the chloride method where group V trichlorides interact with the appropriate III - V compound or group III metal ; ( 3 ) the organometallic method where group III elements are intro- duced ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min