Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 176
John L. Vossen, Werner Kern. EXTRACTOR ION SOURCE ( a ) ION SOURCE SUBSTRATE ION BEAM SUBSTRATE SPUTTERED MATERIAL TARGET EXTRACTOR C ION BEAM ( b ) Fig . 1. Ion beam deposition configurations . ( a ) Primary ion beam deposition , with ion ...
John L. Vossen, Werner Kern. EXTRACTOR ION SOURCE ( a ) ION SOURCE SUBSTRATE ION BEAM SUBSTRATE SPUTTERED MATERIAL TARGET EXTRACTOR C ION BEAM ( b ) Fig . 1. Ion beam deposition configurations . ( a ) Primary ion beam deposition , with ion ...
Page 179
... ion sources use a separately heated thermionic cathode to supply elec- trons ... source and sputtering of cathode material into the discharge . The second ... source and allow operation at lower pressures than with no magnetic field . The ...
... ion sources use a separately heated thermionic cathode to supply elec- trons ... source and sputtering of cathode material into the discharge . The second ... source and allow operation at lower pressures than with no magnetic field . The ...
Page 182
... Ion Sources Several additional ion source types will be mentioned , with refer- ences , to indicate the variety of approaches to generating ions . These are listed with the hope of stimulating novel applications to thin film deposi ...
... Ion Sources Several additional ion source types will be mentioned , with refer- ences , to indicate the variety of approaches to generating ions . These are listed with the hope of stimulating novel applications to thin film deposi ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min