Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 183
... limited current flow [ 4 , 38 ] . In a planar geometry the space charge limited current density between two planes a distance d apart with potential difference V is j = ( 4 €。/ 9 ) ( 2q / m ) 1/2 ( V3 / 2 / d2 ) , where is the ...
... limited current flow [ 4 , 38 ] . In a planar geometry the space charge limited current density between two planes a distance d apart with potential difference V is j = ( 4 €。/ 9 ) ( 2q / m ) 1/2 ( V3 / 2 / d2 ) , where is the ...
Page 227
... limited than the emf series would suggest . The deposits produced by displacement deposition are usually pow- dery , nonadherent , and not useful as coatings . However , in a few cases the process can be made to yield a coherent and ...
... limited than the emf series would suggest . The deposits produced by displacement deposition are usually pow- dery , nonadherent , and not useful as coatings . However , in a few cases the process can be made to yield a coherent and ...
Page 404
... limited . On the other hand , if the rate is determined by the speed at which fresh reactant can be supplied to the surface , the process is said to be diffusion limited . If a series of materials are all etched in the same solution by ...
... limited . On the other hand , if the rate is determined by the speed at which fresh reactant can be supplied to the surface , the process is said to be diffusion limited . If a series of materials are all etched in the same solution by ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min