Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 89
... field in the PC adjacent to the anode ( in configurations with axial anodes ) and the for- mation of a negative space charge ( NSC ) anode sheath if the anode diame- ter is small . If the magnetic field is made very strong , the ...
... field in the PC adjacent to the anode ( in configurations with axial anodes ) and the for- mation of a negative space charge ( NSC ) anode sheath if the anode diame- ter is small . If the magnetic field is made very strong , the ...
Page 95
... magnetic field strength . Copper cathode , argon : ⚫ , 10 mTorr ; O , 0.5 mTorr . with pressure ( more collision targets to make ionization ) . At a fixed volt- age and pressure the current increases with the magnetic field strength ...
... magnetic field strength . Copper cathode , argon : ⚫ , 10 mTorr ; O , 0.5 mTorr . with pressure ( more collision targets to make ionization ) . At a fixed volt- age and pressure the current increases with the magnetic field strength ...
Page 132
... magnetic field lines parallel to the cathode surface is a closed path . Although there are many variations in geometry , all have in common a closed path or region in front of a substantially flat cathode sur- face where the magnetic ...
... magnetic field lines parallel to the cathode surface is a closed path . Although there are many variations in geometry , all have in common a closed path or region in front of a substantially flat cathode sur- face where the magnetic ...
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Common terms and phrases
Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York