Thin film processes, Volume 1Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 508
dynamic pumping, and a discharge is ignited and maintained until all traces of
photoresist are removed. For most resist stripping operations, the materials
exposed to the discharge, other than the photoresist, are relatively unaffected by
an ...
dynamic pumping, and a discharge is ignited and maintained until all traces of
photoresist are removed. For most resist stripping operations, the materials
exposed to the discharge, other than the photoresist, are relatively unaffected by
an ...
Page 535
Photoresists are by far the most often employed materials, although almost any
material in which a pattern can be generated is useful, provided it has an
acceptable rate of erosion for the etching conditions used. Masks which are
totally inert to ...
Photoresists are by far the most often employed materials, although almost any
material in which a pattern can be generated is useful, provided it has an
acceptable rate of erosion for the etching conditions used. Masks which are
totally inert to ...
Page 541
Simple model depicting the stages in ion beam etching of grooves using a
photoresist mask, (a) The photoresist cross section before etching, (b) and (c) As
etching proceeds facets are formed and coating of the side walls by redeposition
takes ...
Simple model depicting the stages in ion beam etching of grooves using a
photoresist mask, (a) The photoresist cross section before etching, (b) and (c) As
etching proceeds facets are formed and coating of the side walls by redeposition
takes ...
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Contents
Glow Discharge Sputter Deposition | 12 |
Glow Discharges | 24 |
Equipment Configuration | 31 |
Copyright | |
8 other sections not shown
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Common terms and phrases
A/min Abstr alloys anode Appl applications argon atoms bias cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial Epitaxial Epitaxial Epitaxial etch rate etchant etching processes film deposition flow rate GaAs gases glow discharge polymerization heating increase ion beam deposition ion source ionization Kern layer magnetic field magnetron mask metal mTorr operation oxide photoresist Phys plasma etching plating PM sputtering polishing polymer polymer deposition potential power density power supply pressure Proc produce ratio RCA Rev reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon nitride solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York
Bibliographic information
| Title | Thin film processes, Volume 1 Thin Film Processes, Werner Kern |
| Author | John L. Vossen |
| Editors | John L. Vossen, Werner Kern |
| Edition | 8, illustrated |
| Publisher | Academic Press, 1978 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 0127282505, 9780127282503 |
| Length | 564 pages |
| Subjects | › › Technology & Engineering / Electronics / General Technology & Engineering / General Technology & Engineering / Materials Science Thin films |
| Export Citation | BiBTeX EndNote RefMan |