Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
From inside the book
Results 1-3 of 86
Page 364
... plasma - induced polymerization and another is plasma polymerization . Plasma - induced polymerization is essentially the conventional ( molecular ) polymerization triggered by a reactive ... PLASMA Plasma Polymerization Plasma 364 H. YASUDA.
... plasma - induced polymerization and another is plasma polymerization . Plasma - induced polymerization is essentially the conventional ( molecular ) polymerization triggered by a reactive ... PLASMA Plasma Polymerization Plasma 364 H. YASUDA.
Page 367
... plasma . Al- though the term F2 plasma is used to describe the effect of detached F in plasma , F2 is not detected in the plasma state , perhaps due to its ex- tremely high reactivity [ 74 ] . It is interesting to note that F and O are ...
... plasma . Al- though the term F2 plasma is used to describe the effect of detached F in plasma , F2 is not detected in the plasma state , perhaps due to its ex- tremely high reactivity [ 74 ] . It is interesting to note that F and O are ...
Page 562
... Plasma anodization , 4 , 356 Plasma deposition application , 357-358 control parameters , 337 system requirement , 337-342 Plasma deposition reactors electrode design , 338-339 flat , 337-339 , 348-351 parallel - plate , 337–339 , 348 ...
... Plasma anodization , 4 , 356 Plasma deposition application , 357-358 control parameters , 337 system requirement , 337-342 Plasma deposition reactors electrode design , 338-339 flat , 337-339 , 348-351 parallel - plate , 337–339 , 348 ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
10 other sections not shown
Other editions - View all
Common terms and phrases
Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min