Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 213
... plating is to continue . Not all metal substrates are spontaneously plated in electroless plating solutions , but steps can be taken to initiate deposition . Autocatalytic plating takes place linearly with time , in a manner similar to ...
... plating is to continue . Not all metal substrates are spontaneously plated in electroless plating solutions , but steps can be taken to initiate deposition . Autocatalytic plating takes place linearly with time , in a manner similar to ...
Page 219
... plating has proved to be particularly valuable in the rela- tively modern technique of plating on nonconductors , especially synthetic plastics and printed circuit boards [ 14 , 16 ] . Plating on nonconductors has been practiced about ...
... plating has proved to be particularly valuable in the rela- tively modern technique of plating on nonconductors , especially synthetic plastics and printed circuit boards [ 14 , 16 ] . Plating on nonconductors has been practiced about ...
Page 231
... plating and similar processes such as electrorefining and elec- trowinning , we are often interested only in the ... plating differs widely from one type of process to another , and also depends on such factors as bath concentration ...
... plating and similar processes such as electrorefining and elec- trowinning , we are often interested only in the ... plating differs widely from one type of process to another , and also depends on such factors as bath concentration ...
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Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York