Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 362
... polymerization refers to polymeriza- tion mechanisms that constitute a portion of the glow discharge polymer- ization . II . CHARACTERISTIC ASPECTS OF GLOW DISCHARGE POLYMERIZATION A. Glow Discharge Polymerization Although the ...
... polymerization refers to polymeriza- tion mechanisms that constitute a portion of the glow discharge polymer- ization . II . CHARACTERISTIC ASPECTS OF GLOW DISCHARGE POLYMERIZATION A. Glow Discharge Polymerization Although the ...
Page 363
... polymer is conventionally named by " poly + ( the monomer ) " . For instance , the polymer formed by the polymerization of styrene is named polystyrene . In this conventional context , polymerization refers to molecular polymer- ization ...
... polymer is conventionally named by " poly + ( the monomer ) " . For instance , the polymer formed by the polymerization of styrene is named polystyrene . In this conventional context , polymerization refers to molecular polymer- ization ...
Page 367
... polymer surfaces ; instead , the incorporation of N into the surface predominates [ 75 ] . Nevertheless , the importance of the ablation process shown in Fig . 1 seems to be well demonstrated by the poor polymer formation in glow ...
... polymer surfaces ; instead , the incorporation of N into the surface predominates [ 75 ] . Nevertheless , the importance of the ablation process shown in Fig . 1 seems to be well demonstrated by the poor polymer formation in glow ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min