Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 382
... Polymer Deposition In the practical sense , the rate at which a polymer deposits is an ex- tremely important aspect of the process . The rate of polymer deposition can be increased by increasing the characteristic rate of polymer forma ...
... Polymer Deposition In the practical sense , the rate at which a polymer deposits is an ex- tremely important aspect of the process . The rate of polymer deposition can be increased by increasing the characteristic rate of polymer forma ...
Page 383
... polymer formation or bypass ratio of the flow ) and / or the efficiency of discharge power input . Therefore , the apparent dependence of the polymer deposition rate on flow rate is often character- ized by a decrease of the polymer ...
... polymer formation or bypass ratio of the flow ) and / or the efficiency of discharge power input . Therefore , the apparent dependence of the polymer deposition rate on flow rate is often character- ized by a decrease of the polymer ...
Page 385
... polymer deposition may be visualized from the data shown in Figs . 14-19 obtained from an rf ( inductively cou- pled ) discharge [ 91-93 ] . The general trends are as follows : Deposition Rote , Å / min 1600r 1400 1200- 1000 --- 800 ...
... polymer deposition may be visualized from the data shown in Figs . 14-19 obtained from an rf ( inductively cou- pled ) discharge [ 91-93 ] . The general trends are as follows : Deposition Rote , Å / min 1600r 1400 1200- 1000 --- 800 ...
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Common terms and phrases
Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York