Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 382
... Polymer Deposition In the practical sense , the rate at which a polymer deposits is an ex- tremely important aspect of the process . The rate of polymer deposition can be increased by increasing the characteristic rate of polymer forma ...
... Polymer Deposition In the practical sense , the rate at which a polymer deposits is an ex- tremely important aspect of the process . The rate of polymer deposition can be increased by increasing the characteristic rate of polymer forma ...
Page 383
... polymer formation or bypass ratio of the flow ) and / or the efficiency of discharge power input . Therefore , the apparent dependence of the polymer deposition rate on flow rate is often character- ized by a decrease of the polymer ...
... polymer formation or bypass ratio of the flow ) and / or the efficiency of discharge power input . Therefore , the apparent dependence of the polymer deposition rate on flow rate is often character- ized by a decrease of the polymer ...
Page 385
... polymer deposition may be visualized from the data shown in Figs . 14-19 obtained from an rf ( inductively cou- pled ) discharge [ 91-93 ] . The general trends are as follows : Deposition Rote , Å / min 1600 1400 1200- 1000F O ...
... polymer deposition may be visualized from the data shown in Figs . 14-19 obtained from an rf ( inductively cou- pled ) discharge [ 91-93 ] . The general trends are as follows : Deposition Rote , Å / min 1600 1400 1200- 1000F O ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min