Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 219
... possible to deposit a con- ducting surface to which conventional electroplates could be applied , building up the thickness to any degree required . Many of these pro- cesses , especially adapted to plating on plastics , are proprietary ...
... possible to deposit a con- ducting surface to which conventional electroplates could be applied , building up the thickness to any degree required . Many of these pro- cesses , especially adapted to plating on plastics , are proprietary ...
Page 337
... possible to describe or catalog here in detail all of the designs and experimental approaches that have been taken ; rather , gen- eral principles and some laboratory examples will be given to exemplify the requirements and techniques ...
... possible to describe or catalog here in detail all of the designs and experimental approaches that have been taken ; rather , gen- eral principles and some laboratory examples will be given to exemplify the requirements and techniques ...
Page 458
... possible with- [ 57 , 504 * ] out increases in etch rate and undercutting Polishing etch ; contact to noble metals is possible with- [ 57 ] out increase in etch rate and undercutting Gas evolution occurs [ 14 ] 11 1 Electro Glo 100 ...
... possible with- [ 57 , 504 * ] out increases in etch rate and undercutting Polishing etch ; contact to noble metals is possible with- [ 57 ] out increase in etch rate and undercutting Gas evolution occurs [ 14 ] 11 1 Electro Glo 100 ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min