Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 33
... cm2 ) , the most commonly used type of dc supply involves an autotransformer - controlled high - volt- age transformer that is magnetically shunted followed by a full II - 1 . GLOW DISCHARGE SPUTTER DEPOSITION 33 B Power Supplies.
... cm2 ) , the most commonly used type of dc supply involves an autotransformer - controlled high - volt- age transformer that is magnetically shunted followed by a full II - 1 . GLOW DISCHARGE SPUTTER DEPOSITION 33 B Power Supplies.
Page 161
John L. Vossen, Werner Kern. from cathode to ground . Power supplies developed for cylindrical or coni- cal ... Supply Design A typical magnetron power supply [ 14 , 43 ] employs a silicon- controlled rectifier dc drive for the control ...
John L. Vossen, Werner Kern. from cathode to ground . Power supplies developed for cylindrical or coni- cal ... Supply Design A typical magnetron power supply [ 14 , 43 ] employs a silicon- controlled rectifier dc drive for the control ...
Page 166
... Supplies and Matching Networks In contrast to dc PM sputtering , rf power supplies developed for con- ventional 13.56 MHz rf sputtering are also suitable for rf PM sputtering . Commercial rf sputtering supplies can tolerate the ...
... Supplies and Matching Networks In contrast to dc PM sputtering , rf power supplies developed for con- ventional 13.56 MHz rf sputtering are also suitable for rf PM sputtering . Commercial rf sputtering supplies can tolerate the ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min