Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 119
... range of Ar pressure in two modes : ( a ) constant current and ( b ) constant power . In Fig . 7 the deposition rates in a 48 cm planetary system of Al- 2 % Si are shown for the two modes over a range of Ar pressures . The source was ...
... range of Ar pressure in two modes : ( a ) constant current and ( b ) constant power . In Fig . 7 the deposition rates in a 48 cm planetary system of Al- 2 % Si are shown for the two modes over a range of Ar pressures . The source was ...
Page 269
... range , indicating that the nature of the rate - controlling step changes with temperature . The observed behavior suggests that in the lower range , the rate - controlling step is some surface process , the rate of which is ...
... range , indicating that the nature of the rate - controlling step changes with temperature . The observed behavior suggests that in the lower range , the rate - controlling step is some surface process , the rate of which is ...
Page 369
... range ) requires internal electrodes . With higher frequencies , external electrodes or a coil also can be used ... range , it is necessary to employ magnetic enhancement . Under typical conditions , polymer deposition occurs mainly onto ...
... range ) requires internal electrodes . With higher frequencies , external electrodes or a coil also can be used ... range , it is necessary to employ magnetic enhancement . Under typical conditions , polymer deposition occurs mainly onto ...
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Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York