Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 211
... reducing agent dissolved in a second solution ; the two solutions are mixed just before using , or are sprayed from a two - nozzle gun on the surface to be silvered . The Brashear formula has been a standard for many years [ 2-4 ] . The ...
... reducing agent dissolved in a second solution ; the two solutions are mixed just before using , or are sprayed from a two - nozzle gun on the surface to be silvered . The Brashear formula has been a standard for many years [ 2-4 ] . The ...
Page 212
... reducing agents . Most of these have been super- seded by " electroless copper , " which is considered in a later section . 3. Gold Gold films are used for decorative purposes , as well as for optical fil- ters for making transparent ...
... reducing agents . Most of these have been super- seded by " electroless copper , " which is considered in a later section . 3. Gold Gold films are used for decorative purposes , as well as for optical fil- ters for making transparent ...
Page 213
... reduction that is catalyzed by the metal or alloy being deposited " [ 11 ] . The process yields a continuous buildup of a metal or alloy coating on suitable substrates simply by immersion in the electroless solution . A chemical reducing ...
... reduction that is catalyzed by the metal or alloy being deposited " [ 11 ] . The process yields a continuous buildup of a metal or alloy coating on suitable substrates simply by immersion in the electroless solution . A chemical reducing ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min