Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 211
... reducing agent dissolved in a second solution ; the two solutions are mixed just before using , or are sprayed from a two - nozzle gun on the surface to be silvered . The Brashear formula has been a standard for many years [ 2–4 ] . The ...
... reducing agent dissolved in a second solution ; the two solutions are mixed just before using , or are sprayed from a two - nozzle gun on the surface to be silvered . The Brashear formula has been a standard for many years [ 2–4 ] . The ...
Page 212
... reducing agents . Most of these have been super- seded by " electroless copper , " which is considered in a later section . 3. Gold Gold films are used for decorative purposes , as well as for optical fil- ters for making transparent ...
... reducing agents . Most of these have been super- seded by " electroless copper , " which is considered in a later section . 3. Gold Gold films are used for decorative purposes , as well as for optical fil- ters for making transparent ...
Page 213
... reduction that is catalyzed by the metal or alloy being deposited " [ 11 ] . The process yields a continuous buildup of a metal or alloy coating on suitable substrates simply by immersion in the electroless solution . A chemical reducing ...
... reduction that is catalyzed by the metal or alloy being deposited " [ 11 ] . The process yields a continuous buildup of a metal or alloy coating on suitable substrates simply by immersion in the electroless solution . A chemical reducing ...
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Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York