Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 224
... resistance , and 3 for both corrosion resistance plus low electrical resistance . Many proprietary products can meet these specifications : Be can be chromated in essentially the same way as Al , Mg is chromated according to MIL - M ...
... resistance , and 3 for both corrosion resistance plus low electrical resistance . Many proprietary products can meet these specifications : Be can be chromated in essentially the same way as Al , Mg is chromated according to MIL - M ...
Page 236
... resistance of the electrolyte . If we neglect the heating effect of the current , the electrolytic resistance will remain constant so long as the solution composition does . The higher the current density required , the higher is the ...
... resistance of the electrolyte . If we neglect the heating effect of the current , the electrolytic resistance will remain constant so long as the solution composition does . The higher the current density required , the higher is the ...
Page 253
... resistance to salt environments is required . Or- ganic materials may be used when lubricity is a factor . Anodic coatings on Al may serve one or more of the following func- tions : better corrosion resistance , better paint adhesion ...
... resistance to salt environments is required . Or- ganic materials may be used when lubricity is a factor . Anodic coatings on Al may serve one or more of the following func- tions : better corrosion resistance , better paint adhesion ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min