Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 224
... resistance , and 3 for both corrosion resistance plus low electrical resistance . Many proprietary products can meet these specifications : Be can be chromated in essentially the same way as Al , Mg is chromated according to MIL - M ...
... resistance , and 3 for both corrosion resistance plus low electrical resistance . Many proprietary products can meet these specifications : Be can be chromated in essentially the same way as Al , Mg is chromated according to MIL - M ...
Page 236
... resistance of the electrolyte . If we neglect the heating effect of the current , the electrolytic resistance will remain constant so long as the solution composition does . The higher the current density required , the higher is the ...
... resistance of the electrolyte . If we neglect the heating effect of the current , the electrolytic resistance will remain constant so long as the solution composition does . The higher the current density required , the higher is the ...
Page 253
... resistance to salt environments is required . Or- ganic materials may be used when lubricity is a factor . Anodic coatings on Al may serve one or more of the following func- tions : better corrosion resistance , better paint adhesion ...
... resistance to salt environments is required . Or- ganic materials may be used when lubricity is a factor . Anodic coatings on Al may serve one or more of the following func- tions : better corrosion resistance , better paint adhesion ...
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Å/min alloys anode Appl argon atoms cathode chemical coatings compounds current density cylindrical-post magnetron deposition rate effect elec electric Electrochem electroless electrolytic electroplating energy Epitaxial erosion etch rate etchants etching field lines film deposition flow gas pressure gases glow discharge glow discharge polymerization H₂ H₂O heating increase ion beam deposition ion bombardment ion source ionization J. A. Thornton layer mA/cm² magnetic field magnetron magnetron sputtering material metal mTorr N₂ negative neutral nitride O₂ operation oxide Phys planar magnetron plasma plating PM sputtering polymer potential power density power supply Proc reaction reactive gas reactive sputtering reactor region secondary electrons Section semiconductor shown in Fig silicon SiO2 solution sputter deposition Sputter Gun sputter yield sputtering gas stoichiometry substrate target surface Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage York