Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 26
... space charge as a function of distance from cathode to anode . Adjacent to the cathode , there is a brilliant lumi- nous layer known as the cathode glow ... SPACE DARK VOLTAGE NET SPACE CHARGE | NEGATIVE GLOW 26 J. L. VOSSEN AND J. J. CUOMO.
... space charge as a function of distance from cathode to anode . Adjacent to the cathode , there is a brilliant lumi- nous layer known as the cathode glow ... SPACE DARK VOLTAGE NET SPACE CHARGE | NEGATIVE GLOW 26 J. L. VOSSEN AND J. J. CUOMO.
Page 84
... space is a positive space charge sheath . Such a sheath is shown schematically in Fig . 6. The thickness d , is taken to be that of the region where the electron density is negligible and where the potential drop V , occurs . The ion ...
... space is a positive space charge sheath . Such a sheath is shown schematically in Fig . 6. The thickness d , is taken to be that of the region where the electron density is negligible and where the potential drop V , occurs . The ion ...
Page 137
... SPACE SHIELD Fig . 4. Examples of cathode isolation geometries . sign , have vacuum - to - coolant O - ring seals . Slight leakage through such seals may not be detected , and total seal failure can be catastrophic . The second design ...
... SPACE SHIELD Fig . 4. Examples of cathode isolation geometries . sign , have vacuum - to - coolant O - ring seals . Slight leakage through such seals may not be detected , and total seal failure can be catastrophic . The second design ...
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min