Thin Film Processes, Volume 1John L. Vossen, Werner Kern Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Results 1-3 of 97
Page 23
... sputtering conditions , it is possible to compen- sate for this effect by purposely enriching the target in the volatile ma- terial [ 98 ] . 2. Chemical Dissociation Since most compounds have ... SPUTTER DEPOSITION 23 G Chemical Sputtering.
... sputtering conditions , it is possible to compen- sate for this effect by purposely enriching the target in the volatile ma- terial [ 98 ] . 2. Chemical Dissociation Since most compounds have ... SPUTTER DEPOSITION 23 G Chemical Sputtering.
Page 152
... Sputtering yields at 600 V have been tabulated [ 65 ] . Sputtering yields increase with voltage in the 300-800 V range used for dc PM sputtering . Thus part of the rate versus power dependence is due to sputtering yield increasing with ...
... Sputtering yields at 600 V have been tabulated [ 65 ] . Sputtering yields increase with voltage in the 300-800 V range used for dc PM sputtering . Thus part of the rate versus power dependence is due to sputtering yield increasing with ...
Page 159
... sputtering . As Vossen [ 80 ] has pointed out , substrates can indeed be treated as sput- tering targets . In this case , considerable resputtering of the depositing film ... Sputtering from Water II - 4 . PLANAR MAGNETRON SPUTTERING 159.
... sputtering . As Vossen [ 80 ] has pointed out , substrates can indeed be treated as sput- tering targets . In this case , considerable resputtering of the depositing film ... Sputtering from Water II - 4 . PLANAR MAGNETRON SPUTTERING 159.
Contents
Glow Discharge Sputter Deposition | 13 |
Equipment Configuration | 31 |
Preconditioning of Targets Substrates and Systems for Film | 41 |
Copyright | |
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Å/min alloys anode Appl applications argon atoms bias bombardment cathode Chem chemical coatings composition compounds current density deposition rate dielectric discharge power effect electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition flow rate GaAs gases glow discharge polymerization H₂ H₂O heating HNO3 increase ion beam deposition ion source ionization layer mA/cm² magnetic field magnetron mask metal mTorr N₂ nitride O₂ operation oxide photoresist Phys planar plasma plasma etching plating PM sputtering polishing polymer polymer deposition potential pressure Proc produce ratio reactants reaction reactive sputtering reactor Section semiconductor shown in Fig silicon silicon nitride SiO2 solution species sputter deposition Sputter Gun sputtering yield starting material stoichiometry substrate susceptor target surface techniques Technol temperature thermal thickness Thin Film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York µm/min